| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TPS1HB08BQPWPRQ1 | TI/德州仪器 |
HTSSOP-16 |
25+ |
15000 |
||||
| XCVU13P-3FHGC2104E | XILINX/赛灵思 |
BGA |
25+ |
480 |
||||
| XCVU13P-2FLGA2577I | XILINX/赛灵思 |
BGA |
25+ |
590 |
||||
| XCVU7P-2FLVC2104E | XILINX/赛灵思 |
BGA |
25+ |
760 |
||||
| XCVU13P-2FLGB2104I | XILINX/赛灵思 |
BGA |
24+ |
360 |
||||
| XC7Z045-2FFG900I | IC |
XILINX/赛灵思 |
BGA |
24+ |
1280 |
|||
| MPM3810GQB-Z | 光电、光敏传感器 |
MPS/美国芯源 |
QFN12 |
25+ |
25800 |
|||
| MBRB40250TG | MBRB40250TG |
TO263 |
22+ |
6330 |
||||
| F50L1G41LB-104YG2M | ESMT/晶豪科技 |
WSON-8 |
25+ |
27550 |
||||
| XCVU9P-2FLGB2104I | IC |
XILINX/赛灵思 |
BGA |
25+ |
330 |
|||
| XCZU47DR-2FFVE1156I | XILINX/赛灵思 |
BGA |
25+ |
670 |
||||
| KHAA84901B-JC17 | SAMSUNG/三星 |
BGA |
25+ |
9600 |
||||
| BCM88470CB0KFSBG | 其他IC |
BROADCOM/博通 |
BGA |
23+ |
315 |
|||
| XCVU13P-2FLGA2577E | XILINX/赛灵思 |
BGA |
25+ |
690 |
||||
| K4A8G165WC-BCTD | SAMSUNG/三星 |
FBGA96 |
25+ |
33650 |
||||
| AT7456E | 中科微 |
TSSOP28 |
25+ |
22500 |
||||
| F2800137PMR | TI/德州仪器 |
LQFP-64 |
24+ |
15600 |
||||
| CP2130-F01-GMR | 其他被动元件 |
SILICON/芯科 |
24-QFN |
24+ |
15500 |
|||
| AD5235BRUZ25 | 数字电位器 |
ADI/亚德诺 |
TSSOP16 |
25+ |
9560 |
|||
| NT5CC256M16ER-EK | NANYA/南亚 |
BGA96 |
25+ |
32200 |
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